Global flavors of LTE bands can be a hassle for travelers and firms making multiple versions of the same device, but Qualcomm says its solved that quandary with a new radio chipset. Dubbed the RF360, the silicon is hailed as the world's first mobile chip that packs support for global LTE, which translates to connectivity for LTE-FDD, LTE-TDD, WCDMA, EV-DO, CDMA 1x, TD-SCDMA and GSM / EDGE -- breaking down the barriers separating roughly 40 different LTE bands. Not only does it lend globetrotters a hand, but Qualcomm claims the component carries a few other "world's first" features that allow manufacturers to build thinner products with improved antenna performance, battery life and connection reliability. The outfit also unveiled the WTR1625L chip, which stakes claim to an industry first by sporting carrier aggregation alongside international LTE compatibility. Hardware made with the RF360 isn't expected to arrive on shelves until the latter half of 2013, but for now you can mosey past the break for the nitty gritty details and a video to walk you through them.