Spreading it Thin TIM Roundup 2007

Cooling/Thermal Compounds by KeithSuppe @ 2007-12-13

Arctic Silver dominated the TIM (Thermal transfer Material) industry for many years. They may have invested more in R&D then all their competition combined. Many ask is there anything else out there? Today we hope to answer this question.

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TIM Formulae

Formulas

Madshrimps (c)


As mentioned on the previous page, electrical conductivity is high on the list of criteria where TIM's are concerned. The macro photo above provides a clear example why TIM’s are not made with an extraordinarily high metal content. While higher metal content might out-perform most silicon or synthetics, metal conducts electricity. Looking at the amount of paste and the proximity of the capacitors on the North Bridge surface pictured above, if the paste should reach those SMD's a short would certainly occur damaging any number of components. While metal infused TIM’s held the performance reigns for sometime there was always that "danger" and confusion they conducted more then heat. Currently there are three general categories for TIM formulas including Silicon, Synthetics (ceramic based) and Metal pastes (small amount of trace metals). The search for the ideal TIM has produced some exotic products. One such product released in 2003 was Nanotherm PCM+. Developed by ESG Associates their formula was not only controversial, it was purportedly the first ever active Thermal Transfer Material.

Madshrimps (c)


When Nanotherm PCM+ (Phase Change Material) first arrived it truly impressed besting products from Arctic Silver as shown in our review here. The basis for PCM+ success (at least initially) was not so much the ingredients themselves, but how they supposedly worked. PCM+ was said to undergo a rapid phase change as the main proponent of it’s heat transfer mechanism. Thermal energy generated by the processor passed to the paste and the product changed from a liquid to a gaseous state and back again.

Unfortunately for Nanotherm questions were raised at several PC-Enthusiast Forums which then led to this article Mod Synergy entitled; Nanotherm PCM+ "The after effects raises questions". Nanotherm responded by making changes to their formula and after several revisions I have what may be a sample from that very last batch. PCM+ will be tested here today because of its unique place in TIM history.

TIM Specifics

PCM+ - Application method: spreading
  • No info available

    Madshrimps (c)


    Arctic Cooling MX-2 - Application Method (pdf)
  • Appearance - Grey
  • Viscosity - 285000 cP
  • Thermal conductivity - 4.5W/mK
  • Operating temperature - -45°C ~ 200°C
  • Specific Gravity - 3.96 @ 25°C
  • Volume - 3.5g
  • MSRP - (excl. VAT):
    5,95 € / US$ 7.95

    Madshrimps (c)


    Arctic Silver Ceramique - Application Method
  • Thermal Resistance - <0.007°C-in2/Watt (0.001 inch layer)
  • Thermal Conductance - >200,000W/m2.°C (0.001 inch layer)
  • Average Particle Size - <0.38 microns <0.000015 inch
    ( 67 particles lined up in a row equal 1/1000th of an inch. )
  • Temperature limits - Peak: –150°C to >180°C Long-Term: –150°C to 125°C
  • MSRP - $4.99 (2.5g)

    Madshrimps (c)


    Arctic Silver AS5 - Application Method
  • Thermal Conductance - >350,000W/m2 °C (0.001 inch layer)
  • Thermal Resistance - <0.0045°C-in2/Watt (0.001 inch layer)
  • Average Particle Size - <0.49 microns <0.000020 inch
  • Extended Temperature Limits - Peak: –50°C to >180°C Long-Term: –50°C to 130°C
  • Performance - 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
  • MSRP - $5.99 (3.5g)

    Madshrimps (c)


    Tuniq TX-2 - Application Method - none specified
  • Appearance - Grey
  • Viscosity - 285000 cP
  • Thermal conductivity - 4.5W/mK
  • Operating temperature - -45°C ~ 200°C
  • Specific Gravity - 3.96 @ 25°C
  • Volume - 3.5g
  • MSRP - $5.99

    Madshrimps (c)


    As far as the application methods I chose to follow the manufacturers and then my own ->
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    Comment from Rutar @ 2007/12/13
    that TX-2 seems to be good stuff, but I think you made an error in the ranking of AS5 and MX2 because AS5 definatly looses for long term stability and electrical safety


    Have you tested the difference between the line and the blob method?
    Comment from zerotol @ 2007/12/14
    is it difference between applying tim with a blob that BIG ??

    how many times did u guys test that , thats a huge difference in temps
    Comment from jmke @ 2007/12/14
    been using blob method for all my CPU HSF reviews last 2 years and it allows for more consistent results compared to spreading it out over the IHS
    Comment from Rutar @ 2007/12/14
    But there is the method of using a line on intel CPUs or a blob, both without spreading and it has to be solved by scientific testing.
    Comment from thorgal @ 2007/12/15
    Great little write-up Keith, I learned quite a bit

    You've certainly got some attention from other sites as well, even an xtremesystems forum thread about this article
    Comment from Arctucas @ 2007/12/15
    I see a lot of these TIM reviews, but never see my favorite; Shin-Etsu X23.
    Comment from Rutar @ 2007/12/16
    Quote:
    Originally Posted by Arctucas View Post
    I see a lot of these TIM reviews, but never see my favorite; Shin-Etsu X23.
    MX-2 is said to be the same

     

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