The original Overture was a good looking multimedia desktop case which missed the airflow; the new revised version sports the original’s looks and adds some turbulence; this translates into lower system and CPU temperatures.
To go back to the drawing boards after a product has been on the market for an extended period of time shows true character from the Antec crew, their revised version is a large step in the good direction of providing the end-user with a plug and play desktop case which can house high end systems. Although maximum temperatures still come close to *alarming* levels, they have some degrees to spare.
The only fool proof way to get the CPU temperature down is: ducting. Many OEM manufactures cram hot CPU’s into very small desktop cases; the only way they can get away with this is the fact that they incorporate custom ducting vents into their designs. By guiding cool air to the CPU they can run any system in a small closed environment.
The challenge when building a case which has to fit a multitude of systems is to do away with the heat generated in the case, without compromising compatibility, Antec does a great job with Overture when used with systems <2.4Ghz (P4) <1.8Ghz (AMD); Once you cross that speed barrier you have to start thinking of building some air ducts inside the case to keep the CPU cool!
The Overture does away with heat more efficiently as its predecessor but needs some extra cooling vents to really allow HOT systems to be placed inside.
I would like to thank David from Antec
for letting us test-drive the revised Overture.
Questions/Comments: forum thread