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Be Quiet Silent Loop 360 AIO CPU Cooler Review

Cooling/Water Cooling by leeghoofd @ 2017-12-29

At Computex 2017, Be Quiet introduced to the press an upcoming addition to their Silent Loop AIO series, the 360 model, featuring as you could have guessed a massive 360 radiator. The new flagship should top the cooling performance of the 240 and even the 280 model. Be Quiet has received many awards over the last decade and has established itself as one of the market leaders in quiet, yet powerful power supplies and processor cooling gear. Especially their Silent Wings fan series are loved by watercooling purists as these fans feature an excellent combination between airflow/pressure and silent operation. Time to open the box Be Quiet send to the MadShrimps lab. We were keen to test the new 360 Silent Loop version.

Mounting System and Installation

Since both the Fractal Kelvin and Be Quiet series have Alphacool roots it is no surprise that the mounting mechanism is pretty identical to the Kelvin series. Why change something that is easy to install and which is build to last? The Be Quiet Silent Loop series are compatible with the following platforms:

Intel: LGA775/ 1150/ 1151/ 1155/ 1156/ 1366/ 2011(-3)
AMD: AM2(+)/ AM3(+)/ FM1/ FM2(+)

Installation is a simple and effective: just pick the screws compatible with our socket, position the tension spring, the washer and secure it to the mounting plate via the nut. Slide the two mounting plates onto the pump unit and just secure it firmly. All Intel sockets below LGA 2011 need to use the plastic back plate, AMD users need to use the stock motherboard back plate.

Classy touch, the double adhesive on the Intel backplate, to secure it firmly to the motherboard. Pretty handy if you still own one of them cases without a big cutout behind the motherboard.

Also included is a thermal paste syringe with some good Be Quiet paste; this one can be easily spread out over the processor's heatspreader. We followed the detailed installation guide and applied the thermal paste as seen in the photo. Now there is enough paste to do a few re-mounts, even for our large LGA2011 heatspreader.

You can see there's pretty awesome contact between the heat spreader of the processor and the cooling plate, note the fluidity of the thermal paste. This shot was taken after the first stress test session which lasted approximately two hours.

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