After trying out the X SKUs from the Ryzen 5 series, it is now time to also analyze the cheaper, non-X variants which are basically the Ryzen 5 1600 along with the Ryzen 5 1400; these two feature different CCX configurations and our first article will concentrate on the 1600 model.

Versus the Ryzen 5 1600X which did come with a TDP of 95W, the Ryzen 5 1600 comes with a 65W TDP, even if these two models share the same 3+3 CCX configuration. We do also have similarities regarding the total of L3 cache that is 16MB and L2 cache per core, which did remain at 512K; the main differences can be found with the clock speeds: while the 1600X does come with a 3.6GHz base clock, the 1600 does only have a 3.2GHz base.

Regarding boost clocks, the 1600X does have an all-core of 3.7GHz, while the 1600 climbs 200MHz at 3.4GHz all-core; the 2-core boost is available at 4GHz for the higher-spec 1600X, while the 1600 does only climb at 3.6GHz. Furthermore, the 1600X can deliver a 4.1GHz XFR, while the 1600 is able to climb up to 3.7GHz in XFR mode; this type of configuration does not verify the theory where non-XFR SKUs should only climb 50MHz in frequency.

After monitoring with HWiNFO64, we can see how the core clocks do perform in regular use (Current, Minimum Frequency, Maximum Frequency, and Average Frequency):

We won’t bore you again with the technical details since everything we have described along with the Ryzen 5 1600X does also hold with the Ryzen 5 1600. What is really interesting to check is how the lower-spec SKU does hold against the X-variants in multiple benchmarks and games; we will also analyze further on how the CPU performance does modify with the increase of memory clocks, how overclockable this SKU really is and afterwards draw a final conclusion.

The Ryzen 5 1600 CPU sample has arrived in a very simple packaging; if you are getting this particular processor from retail, you will also get with it a stock cooler, so if you do not intend on overclocking the platform, you do not need to invest in a brand new AM4 cooling system too.

The inner transparent plastic mold the CPU is held secure does have the same shape as we have seen with the other processors from the Ryzen series, but this time the Ryzen 5 sticker was not supplied with it:

A closer look at the Ryzen 5 1600 CPU does reveal a central logo that uses specific fonts. The Ryzen CPUs are using solder between the HSF and the cores, for an optimal heat conduction to the cooling system; the later experiments have proven that delidding does not bring any benefit in this case: