Shuttle XPC Slim DX30 Barebone Review

Others/All-in-one PC by stefan @ 2017-02-22

XPC Slim DX30 is one of the latest passively cooled Mini-PCs from Shuttle, which does sport the Intel Celeron J3355 Apollo Lake dual-core SoC. The barebone can be equipped with no less than 8GB of DDR3L SODIMM RAM, a M.2 SSD, one 2.5’’ HDD/SSD while the wireless connectivity is assured by the manufacturer thanks to the preinstalled M.2-2230 WLAN card with Realtek RTL8188EE Controller. The product does feature a lot of interfaces so it can be used at home, in offices but also for industrial applications; in all cases, the overall power consumption is very small thanks to the technological process of the new Intel cores.

  • prev
  • next

Packaging, A Closer Look Part I

Not long ago, we were looking upon another Apollo Lake based system from ECS, with the Liva Z code name; it does pack an Intel Celeron N3350 dual-core SoC built on 14nm and has a clock speed between 1.1GHz and 2.4GHz (Burst). Its iGPU is based on the Intel Gen9 architecture and is equipped with 12 EUs with a clock up to 650MHz (from 200MHz base); additionally, this SoC does also include an advanced video engine with hardware support for playback of VP9 and H.265 (8-bit color depth). The main use of the N3350 dual-core SoC is in tablets, notebooks and 2-in-1 hybrids thanks to its very low power consumption.

 

Shuttle XPC Slim DX30 does feature a SoC from the same Apollo Lake generation and to be more exact the Intel Celeron J3355; this is also a dual-core SoC with a base frequency of 2GHz and can climb up to 2.5GHz in Burst. The same Intel HD Graphics 500 with 12 EUs can be found here, but the frequency can go up as high as 700MHz (from 250MHz base). In this case, the main use of the SoC is specifically Mini PCs.

 

Shuttle DX30 ships inside a compact cardboard enclosure, with the usual box art we have spotted before:

 

 

 

On the box side, we will get to see some of the product technical specifications, but also a warning that this product only operates with DDR3L (1.35V) SODIMM memory modules:

 

 

 

The box is provided with a plastic handle, for easy manipulation:

 

 

 

After opening up the enclosure, we will be able to spot the DX30 along with is bundle, surrounded by quite a bit of foam material:

 

 

 

The product documentation is available in multiple languages and can be found in a transparent plastic re-sealable bag, while the product bundle is located in a separate plain cardboard enclosure:

 

 

 

Besides the actual installation guide, we will also receive mounting instructions for the VESA adapter:

 

 

 

 

 

Let us check out the bundle box and see what Shuttle has prepared for us:

 

 

 

We are receiving a power lead, the power adapter, one Wi-FI antenna, the VESA mount but also the necessary screws for installation:

 

 

 

  • prev
  • next

No comments available.

 

reply