Shuttle XPC Slim DX30 Barebone Review

Others/All-in-one PC by stefan @ 2017-02-22

XPC Slim DX30 is one of the latest passively cooled Mini-PCs from Shuttle, which does sport the Intel Celeron J3355 Apollo Lake dual-core SoC. The barebone can be equipped with no less than 8GB of DDR3L SODIMM RAM, a M.2 SSD, one 2.5’’ HDD/SSD while the wireless connectivity is assured by the manufacturer thanks to the preinstalled M.2-2230 WLAN card with Realtek RTL8188EE Controller. The product does feature a lot of interfaces so it can be used at home, in offices but also for industrial applications; in all cases, the overall power consumption is very small thanks to the technological process of the new Intel cores.

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Product Specifications Part I

Fanless and silent

Completely fanless, virtualy noiseless

Passive cooling through convective heat transfer

Perfect to be used in noise-sensitive environments

Fanless means less dust and thus virtually no maintenance required


Low Power Consumption

Power consumption in idle mode: 7.0 W

Power consumption under full load: 11.8 W / 19.7 W (CPU / CPU+graphics)

(measured with 2x 2 GB DDR3L-1600 SO-DIMMs and 60 GB 2.5" SSD under Windows 10 64-bit)



Nettop PC with black chassis made of steel

Dimensions: 190 x 165 x 43 mm (LWH) = 1.35-litre

Weight: 1.3 kg net and 2.1 kg gross

Two holes for Kensington Locks and numerous

threaded holes (M3) at both sides of the chassis


Operation Position

1) Horizontal

2) Vertical (e.g. VESA-mounted behind an appropriate monitor)

In vertical position, the front USB ports should show upwards.

Ventilation holes must not be blocked to ensure sufficient cooling.

Operation System

This system comes without operating system.

It is compatible with

- Windows 10 (64-bit)

- Linux (64-bit) [7]

Note: Windows 7, 8 and 8.1 are not supported



Intel® Celeron® Processor J3355, Dual Core

CPU clock frequency: 2.0 GHz, max. Turbo frequency: 2.5 GHz

Apollo Lake platform, Goldmont architecture, 14 nm structure

CPU cores / Threads: 2 / 2

L2 Cache: 2 MB

Thermal Design Power (TDP): 10 W

Supports AES-NI, VT-x (EPT), VT-d, Secure Boot

SOC design with integrated graphics processor, no chipset required


Integrated Graphics

The Graphics Processing Unit (GPU) is integrated in the processor

Intel® HD Graphics 500 (9th Gen), graphics frequency: 250~700 MHz

Supports DirectX 12, OpenGL 4.3, OpenCL 1.2, OpenGL ES 3.0, Intel Quick Sync Video, Intel Clear Video (HD)

Execution Units (EU): 12

Video outputs (Resolution):

- HDMI 1.4b: max. 1920 x 1200 @ 60 Hz oder 3840 x 2160 @ 30 Hz

- DisplayPort 1.2: max. 4096 x 2160 @ 60 Hz

- optional: D-Sub (VGA): max. 1920 x 1200 resolution @ 60 Hz [2]

Supports two digital displays simultaneously via HDMI and DisplayPort.

In addition, it supports another analog display if the optional VGA port is built in.


UEFI Firmware

16 MB Flash ROM with AMI's Aptio UEFI BIOS Firmware

Based on the Unified Extensible Firmware Interface (UEFI)

Supports Power fail resume / AC power on state / always on / always off

Supports Wake-on-LAN (WOL) from S3, S4, S5 ACPI states

Supports boot up from external flash memory cards

With embedded Firmware TPM v2.0 (fTPM)



2x SO-DIMM slots with 204-pin

Supports DDR3L-1600/1866 (PC3-12800/14900) SDRAM at 1.35V

Supports Dual Channel mode

Supports max. 8 GB per DIMM

Maximum total size: 8 GB (either 1x 8 GB or 2x 4 GB)

Supports two unbuffered DIMM modules (no ECC)

Note: This mainboard does only support 1.35 V DDR3L memory modules.

DDR3L has a lower operation voltage as compared to DDR3


2.5" Bay for Hard disk drive/SSD

Supports one Serial ATA hard disk (5400 / 7200 rpm)

or one SATA SSD drive in 6.35 cm / 2.5" format

Serial ATA III Interface with up to 600 MB/s transfer speed

Supports a drive with a max. height 12.5 mm

Pre-installed SATA cable (data / power)


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